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What are Onshape Custom Features?

Certified Onshape Professional Too Tall Toby explains how to supercharge your workflow using community-created tools. In this insightful tutorial, he dives into the world of FeatureScript -- the powerful coding language behind Onshape. Learn where to find new scripts and how to use them. Save time. Learn new skills, shortcuts, and maybe even better ways to do things. Incorporate Custom Features into your everyday work. Very useful.
View the video.

What can you do with touchless magnetic angle sensors?

Novotechnik has put together an informative video highlighting real-world applications for their RFC, RFE, and RSA Series touchless magnetic angle sensors. You may be surprised at the variety of off-highway, marine, material handling, and industrial uses. You'll learn how they work (using a Hall effect microprocessor to detect position) and their key advantages, including eliminated wear and tear on these non-mechanical components. We love when manufacturers provide such useful examples.
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What can the new Autodesk Inventor AI Assistant do for you?

Autodesk Assistant brings industry-specific context to help execute tasks and orchestrate actions across your 3D models -- not just answer questions. Designed to understand your workflows, Assistant appears as a dockable panel alongside your Inventor workspace and includes the ability to perform complex tasks or gather information from your designs without writing a single line of code. Find out what this new AI "colleague" can do for you.
Watch this informative Autodesk video.

Useful! Snap-together LED enclosure lighting

Seifert StripLite SL 4000 Series LED enclosure lighting provides bright illumination to 700 lumens. On/off switch and motion sensor models are available. Easily daisy chain up to 16 light strips. Magnetic or clip mounting. See video/info on website or contact Bristol Instruments for more information.
Learn about snap-together lighting.

Next-gen multi-touch panels

Beckhoff's Next line of multi-touch control panels and panel PCs is engineered for demanding human-machine interface and control tasks. These panels offer convenient operation with advanced multi-touch technology, a high-quality look and feel, anti-glare and anti-ghosting effects, and a wide choice of formats (from 7 to 23.8 in.) and options. A main draw is the line's attractive pricing.
Learn more.

Most powerful handheld 3D laser scanner on the market

Creaform, a business of AMETEK, has launched HandySCAN 3D|EVO Series, the most powerful handheld 3D laser scanning solution on the market. This innovative series features a built-in touchscreen display and an integrated high-res 12-MP photo camera, incorporating augmented reality (AR) and advanced on-scanner visualization. Users can streamline repetitive inspections and enhance quality control processes using the new auto-alignment feature. Powered by 46 blue laser lines with accuracy of 0.020 mm. The Creaform Metrology Suite includes four application software modules: Scan-to-CAD, Inspection, Automation, and Dynamic Tracking. So many more features.
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Continental develops first sensor to measure heat in EV motors

Global automotive supplier Continental has developed a new sensor technology that measures the temperature inside permanently excited synchronous motors in electric vehicles directly on the rotor for the first time.
Read the full article.

LEDs with highest output power available

The new OCI-460 SWIR LED series from EPIGAP OSA Photonics features markedly improved output power compared to the company's previous OCI-480 package and all competitive SMD SWIR LED devices. For example, model OCI-460 ID1550-XS operates at 1,550 nm and features drive current up to 1.5A to deliver approximately 13% higher output efficiency over EPIGAP's OCI-480 package. This impressive advancement features 96% higher output power compared to any other SWIR SMD LED currently on the market. Ideal for use in sensing, machine vision, and more.
Learn more.

AI and collaboration in SOLIDWORKS

Discover AURA, the new AI assistant built into SOLID-WORKS, in this informative video from TriMech Group. What can AURA do for you? It can streamline workflows and make collaborating on and tracking projects even easier, for starters. Other top features of SOLIDWORKS Design 2026 are also covered. Some good tips here.
View the TriMech Group video.

Solutions for weighing and force measurement

Automation-Direct now offers Sensy 2172L series single point, 5510 series shear beam, and 2782 series tension/compression load cells that deliver flexible solutions for weighing and force measurement. They are ideal for applications ranging from small packaging scales to rugged industrial tanks and conveyor systems. Built from aircraft-grade aluminum or stainless steel, these models feature built-in overload protection, accuracies down to 0.03% of full scale, protection ratings up to IP67, and capacities up to 2,000 kg.
Learn more.

Top Product: Future-proof enclosure cooling

Seifert's new SLIMLINE NEO ushers in next-generation industrial cooling with natural refrigerant R290 (GWP 0.02) and high-efficiency inverter technology. It cuts energy costs with EER up to 3.6, reduces refrigerant charge by 75%, and extends electronics life. A fully redesigned, lighter, smaller enclosure delivers lower vibration, better component protection, and easier handling. Available in two elegant surfaces: stainless steel and mild steel, powder coated.
Learn more.

Coin cell supercapacitors: High capacity, quick release

Coin cell supercapa-citors are compact, high-capacity energy storage devices that rapidly charge and discharge and endure far more cycles than rechargeable batteries. They're ideal for high switching loads such as real-time clock and battery back-up power, battery-swap ride-through, and LED or audible alarms. SCHURTER's latest versions support up to 5.5 V and 100 to 1,500 mF.
Learn more.

Tech Tip: Mastering sheet metal bend calculations in Onshape

Mastering bend calculations in sheet metal design is a key skill that can impact the accuracy and manufactur-ability of your designs significantly. Explore the various options available to become a pro in this Onshape Tech Tip: K Factor, bend allowance, and bend deduction, with guidance on when each should be used. You will probably learn something even if you don't use this software.
Read the Onshape blog.

Digital Engineering: How a private jet gets a high-end refurb

Ever wonder how private jets get overhauled from standard OEM layouts to exotic, artful interiors? It takes engineering expertise, specialty design skills, and true craftspeople. Increasingly, it also takes automation provided by middleware to weave a digital thread through CAD, BOM, ERP, and PDM software.
Read the full article.

How AI is quietly transforming simulation

Is AI really useful, or is it just a passing trend? Balavignesh Vemparala, an R&D Engineer II at ANSYS, lays out a compelling case for how artificial intelligence is already hard at work in the simulation world with real results for users. From faster solves to accelerated workflows, improved quality and traceability, generative models, and more, discover what you might be overlooking when it comes to real-world AI application. Worth the read.
Read this informative ANSYS blog.

Siemens unveils next-gen AI-enhanced Electronic Systems Design software

One of the standout features of the next generation of HyperLynx is its new, modern user experience. Shared by all Xpedition and HyperLynx products, the next generation of electronic systems design dramatically increases productivity and makes HyperLynx analysis available to a wider group of designers. [Credit: Image courtesy of Siemens]

 

 

 

 

Siemens Digital Industries Software has just announced the latest advancement in its electronic systems design portfolio. The next-generation release takes an integrated and multidisciplinary approach, bringing together Xpedition software, Hyperlynx software, and PADS Professional software into a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.

The challenges of engineering talent shortages, supply chain uncertainties, and the increasing complexity of designs in the electronic systems design industry have impacted engineers and the development ecosystem, hindering their ability to meet the demands of modern electronics development.

"This release represents our most thoroughly vetted solution to date, incorporating feedback from hundreds of participants," said AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. "By unifying the Xpedition, HyperLynx, and PADS Pro environments and infusing this with AI, our customers will be ready to tackle their challenges head on."

Focused on providing highly intuitive tools, the new toolset adds predictive engineering and new support assistance using AI, enhancing engineers' capabilities, while streamlining and optimizing their workflows. Cloud connectivity will facilitate collaboration across the value chain and provide access to specialized services and resources, enabling engineers to adapt rapidly to changing requirements, supply chain insights, and easier collaboration with stakeholders, regardless of location.

The Siemens' solution will facilitate the seamless flow of data and information throughout the product lifecycle using digital threads. This integration fosters collaboration, informed decision-making, and optimized designs.

"We are delighted to have collaborated with Siemens, providing feedback as an active user, as they have developed this next-generation toolset," said Tom Pitchforth, vice president of Electronics Engineering at Leonardo, a global industrial group that builds technological capabilities in aerospace, defense, and security. "Siemens has been a critical partner for us for over 20 years, and it is essential that our toolset providers align with our future needs, particularly in a rapidly changing and complex landscape. Our primary goals in leveraging the new toolset capabilities include strategic objectives, such as enabling organizational flexibility, and tactical objectives, such as achieving rapid time-to-productivity.

The software also brings enhanced integration with Siemens' Teamcenter software for product lifecycle management and NX software for product engineering, allowing for multi-BOM support and tighter collaboration between ECAD and MCAD domains. To prioritize security, it offers rigid data access restrictions that can be configured and geo-located, while adhering to the strictest industry protocols. Siemens maintains partnerships with industry-leading cloud providers to ensure robust security measures. The solution also includes design and verification requirements management for model-based systems engineering support.

Siemens' next-generation electronic systems design solution will be available in the second quarter of 2025. To learn more, go to eda.sw.siemens.com/en-US/pcb/.

Source: Siemens Digital Industries Software

Published November 2024

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