Designfax weekly eMagazine

Subscribe Today!

Archives

View Archives

Partners

Manufacturing Center
Product Spotlight

Modern Applications News
Metalworking Ideas For
Today's Job Shops

Tooling and Production
Strategies for large
metalworking plants

Test equipment advancing to meet rapidly changing market needs

Although the rise of the IoT, 5G, and advanced automotive electronics markets is instigating rapid changes in technology, test equipment is keeping pace, and not just in extensions to bandwidth specifications or signal resolution. Maureen Lipps, Multicomp Pro Private Label Product Segment Leader, Test and Tools, Newark Electronics, runs through important advances in the industry and its tools.
Read the full article.

Smallest rugged AI supercomputer for avionics

Aitech Systems has released the A178-AV, the latest iteration of its smallest rugged GPGPU AI super-computers available with the powerful NVIDIA Jetson AGX Xavier System-on-Module. With its compact size, the A178-AV is the most advanced solution for artificial intelligence (AI), deep learning, and video and signal processing for next-gen avionic platforms.
Learn more.

Touchless angle sensors get CAN SAE J1939 interface

Novotechnik has added the CAN J1939 interface (developed for heavy-duty vehicles) to its RFC4800 Series of touchless angle sensors measuring angular position up to 360°, turn direction, turns, speed, and operational status. It can provide one or two output channels. It has a longer life and robustness than an optical encoder. It can signal if a sensor needs replacing or average a programmable number of values to output to reduce external noise if present. This is wear-free angle measurement made easy.
Learn more.

Radar level sensor monitors liquids and powders

The innovative FR Series non-contact radar level sensor from Keyence has been designed to monitor the level of both liquid and powder in any environment. This sensor features short- and long-range models, as well as chemical and sanitary options to address a wide array of level sensing applications. Works even when obstructions or harsh conditions are present, such as build-up, steam, or turbulence.
Learn more.

Raspberry Pi launches $70 AI Kit

Artificial intelligence (AI) is all the rage, and the makers of Raspberry Pi have created a way for enthusiasts of the single-board computer systems to take part and do a lot of experimenting along the way.
Read the full article.

3D model sharing at Brother Industries cuts rework

When Brother Industries, maker of printers, computers, and computer-related electronics, deployed Lattice Technology's XVL Player as a viewer for sharing 3D models throughout the processes of product design, parts design, mold design, mold production, and QA of molded parts, they reduced rework significantly -- especially from downstream departments. XVL Studio with its Difference Check Option helped address the rework in mold design, for example, by always keeping everyone informed of design changes.
Read this real-world case study.

What is 3D-MID? Molded parts with integrated electronics from HARTING

3D-MID (three-dimensional mechatronic integrated devices) technology combines electronic and mechanical functionalities into a single, 3D component. It replaces the traditional printed circuit board and opens up many new opportunities. It takes injection-molded parts and uses laser-direct structuring to etch areas of conductor structures, which are filled with a copper plating process to create very precise electronic circuits. HARTING, the technology's developer, says it's "Like a PCB, but 3D." Tons of possibilities.
Learn more (video included on page).

New! Thermoelectric dehumidifiers for enclosures

Seifert Systems has just introduced its line of compact Soliflex^® Series thermoelectric dehumidifiers, with or without condensate pump. These IP 56-rated units are designed to dehumidify enclosures and small control panels, can be used indoors or outdoors, and are maintenance free. When used with a hygrostat, Soliflex dehumidifiers will keep enclosure humidity below a defined level and only operate when needed.
Learn more.

More Stego enclosure heater options from AutomationDirect

Automation-Direct has added more Stego enclosure heaters to their Enclosure Thermal Management lineup. These new 120 to 240 VAC/VDC units include small, flat versions that distribute heat evenly within compact enclosures and are available with 8- or 10-W heating capacities. Also added are compact loop heaters that feature a patented loop body design for increased natural convection airflow, reduced thermal stress on the heater, and better heat transfer. Loop heaters are available in 10- to 150-W heating capacities.
Learn more.

Great design: Handle with integrated lighting/signaling

Signaling and indicator lights, switches, and buttons -- elements that hardly any machine can do without. The new JW Winco cabinet U-handle EN 6284 integrates all these functions into a single, compact element. The new U-handle is designed to enhance the operation of systems and machines. It features an integrated button and a large, colored, backlit area on the back of the handle. These elements can be used individually or in combination, providing a versatile tool for system control and process monitoring that can be seen from across the room.
Learn more.

Engineer's Toolbox: What is ground loop feedback?

Improper grounding can create problems in data logging, data acquisition, and measurement and control systems. One of the most common problems is known as ground loop feedback. Experts at CAS DataLoggers run through five ways to eliminate this problem.
Read the full article.

AI development kit for multi-camera products

The QCS6490 Vision-AI Development Kit from Avnet enables engineering teams to rapidly prototype hardware, application software, and AI enablement for multi-camera, high-performance, Edge AI-enabled custom embedded products. The kit facilitates design with the new, energy-efficient MSC SM2S-QCS6490 SMARC compute module based on the Qualcomm QCS6490 processor. Provides support for up to four MIPI CSI cameras and concurrent Mini DisplayPort and MIPI DSI displays.
Learn more.

High-temp cabinet cooler keeps incineration process in business

An EXAIR client company handles waste treatment on a large ship by operating an incinerator. The area where the incinerator is located gets very hot (over 120° F). This causes failures in the electronics package used to control the incineration process. Since compressed air is readily available, EXAIR's Model HT4225 Cabinet Cooler System is being used to keep the panel cool. It saved the customer from having to replace their control units due to the hot conditions in the incinerator room. Thermostat control is also available, conserving air and operating only when needed to minimize air consumption.
Learn about EXAIR's huge selection of Cabinet Coolers.

Compact snap-in capacitors for general-purpose applications

TDK's new EPCOS B43659 series of snap-in aluminum electrolytic capacitors is the next generation of ultra-compact, general-purpose components for voltages of 450 V (DC) featuring an extremely high CV product. It provides the same features and serves the same applications as the previous series but is much more compact. These RoHS-compliant capacitors can be used in a wide range of applications, such as switched-mode power supplies, frequency converters, UPS, medical equipment, and solar inverters.
Get all the specs.

Conductive Brush Ring overcomes current leakage in EV powertrains

SKF's new Conductive Brush Ring paves the way to greater reliability and longer life in high-performance electric vehicle powertrain systems. Using pure carbon fiber bristles, it provides a reliable electrical connection between an EV eAxle rotor shaft and its housing. When used in combination with SKF Hybrid ceramic ball bearings, it helps to alleviate parasitic current effects that can lead to premature failure in bearings and other components. Available in different configurations for wet (oil-lubricated) motor designs -- and soon for dry (sealed) applications.
Learn more.

MIT researchers build Quad HD TV chip

A new video standard enables a fourfold increase in the resolution of TV screens, and an MIT chip was the first to handle it in real time.

By Larry Hardesty, MIT

It took only a few years for high-definition televisions to make the transition from high-priced novelty to ubiquitous commodity -- and they now seem to be heading for obsolescence just as quickly. At the Consumer Electronics Show (CES) in January, several manufacturers debuted new ultra-high-definition, or UHD, models (also known as 4K or Quad HD) with four times the resolution of today's HD TVs.

A new video-coding standard known variously as ultra-high-def (UHD), Quad HD, or 4K promises four times the resolution (left) of today's high-definition video. [Image courtesy: MIT]

 

 

Besides screens with four times the pixels, UHD also requires a new video-coding standard, known as high-efficiency video coding, or HEVC. Also at CES, Broadcom announced the first commercial HEVC chip, which it said will go into volume production in mid-2014.

At the International Solid-State Circuits Conference last week (Feb. 17-21), MIT researchers unveiled their own HEVC chip. The researchers' design was executed by the Taiwan Semiconductor Manufacturing Company, through its University Shuttle Program, and Texas Instruments (TI) funded the chips' development.

Although the MIT chip isn't intended for commercial release, its developers believe that the challenge of implementing HEVC algorithms in silicon helps illustrate design principles that could be broadly useful. Moreover, "because we have the chip with us, it is now possible for us to figure out ways in which different types of video data actually interact with hardware," says Mehul Tikekar, an MIT graduate student in electrical engineering and computer science and lead author of the new paper. "People don't really know, 'What is the hardware complexity of doing, say, different types of video streams?'"

In the pipeline
Like older coding standards, the HEVC standard exploits the fact that in successive frames of video, most of the pixels stay the same. Rather than transmitting entire frames, it's usually enough for broadcasters to transmit just the moving pixels, saving a great deal of bandwidth. The first step in the encoding process is thus to calculate "motion vectors" -- mathematical descriptions of the motion of objects in the frame.

On the receiving end, however, that description will not yield a perfectly faithful image, as the orientation of a moving object and the way it's illuminated can change as it moves. So the next step is to add a little extra information to correct motion estimates that are based solely on the vectors. Finally, to save even more bandwidth, the motion vectors and the corrective information are run through a standard data-compression algorithm, and the results are sent to the receiver.

The new chip performs this process in reverse. It was designed by researchers in the lab of Anantha Chandrakasan, the Joseph F. and Nancy P. Keithley Professor of Electrical Engineering and head of the MIT Department of Electrical Engineering and Computer Science. In addition to Chandrakasan and Tikekar, developers include Chiraag Juvekar, another graduate student in Chandrakasan's group; former postdoc Chao-Tsung Huang; and former graduate student Vivienne Sze, now at TI.

The chip's first trick for increasing efficiency is to "pipeline" the decoding process: A chunk of data is decompressed and passed to a motion-compensation circuit, but as soon as the motion compensation begins, the decompression circuit takes in the next chunk of data. After motion compensation is complete, the data passes to a circuit that applies the corrective data and, finally, to a filtering circuit that smooths out whatever rough edges remain.

Fine-tuning
Pipelining is fairly standard in most video chips, but the MIT researchers developed a couple of other tricks to further improve efficiency. The application of the corrective data, for instance, is a single calculation known as matrix multiplication. A matrix is just a big grid of numbers; in matrix multiplication, numbers in the rows of one matrix are multiplied by numbers in the columns of another, and the results are added together to produce entries in a new matrix.

"We observed that the matrix has some patterns in it," Tikekar explains. In the new standard, a 32-by-32 matrix, representing a 32-by-32 block of pixels, is multiplied by another 32-by-32 matrix, containing corrective information. In principle, the corrective matrix could contain 1,024 different values. But the MIT researchers observed that, in practice, "there are only 32 unique numbers," Tikekar says. "So we can efficiently implement one of these [multiplications] and then use the same hardware to do the rest."

Similarly, Juvekar developed a more efficient way to store video data in memory. The "naive way," he explains, would be to store the values of each row of pixels at successive memory addresses. In that scheme, the values of pixels that are next to each other in a row would also be adjacent in memory, but the value of the pixels below them would be far away.

In video decoding, however, "it is highly likely that if you need the pixel on top, you also need the pixel right below it," Juvekar says. "So we optimize the data into small square blocks that are stored together. When you access something from memory, you not only get the pixels on the right and left, but you also get the pixels on the top and bottom in the same request."

Chandrakasan's group specializes in low-power devices, and in ongoing work, the researchers are trying to reduce the power consumption of the chip even further, to prolong the battery life of quad-HD cell phones or tablet computers. One design modification they plan to investigate, Tikekar says, is the use of several smaller decoding pipelines that work in parallel. Reducing the computational demands on each group of circuits would also reduce the chip's operating voltage.

Published February 2013

Rate this article