January 20, 2015 Volume 11 Issue 03

Electrical/Electronic News & Products

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Test equipment advancing to meet rapidly changing market needs

Although the rise of the IoT, 5G, and advanced automotive electronics markets is instigating rapid changes in technology, test equipment is keeping pace, and not just in extensions to bandwidth specifications or signal resolution. Maureen Lipps, Multicomp Pro Private Label Product Segment Leader, Test and Tools, Newark Electronics, runs through important advances in the industry and its tools.
Read the full article.


Smallest rugged AI supercomputer for avionics

Aitech Systems has released the A178-AV, the latest iteration of its smallest rugged GPGPU AI super-computers available with the powerful NVIDIA Jetson AGX Xavier System-on-Module. With its compact size, the A178-AV is the most advanced solution for artificial intelligence (AI), deep learning, and video and signal processing for next-gen avionic platforms.
Learn more.


Touchless angle sensors get CAN SAE J1939 interface

Novotechnik has added the CAN J1939 interface (developed for heavy-duty vehicles) to its RFC4800 Series of touchless angle sensors measuring angular position up to 360°, turn direction, turns, speed, and operational status. It can provide one or two output channels. It has a longer life and robustness than an optical encoder. It can signal if a sensor needs replacing or average a programmable number of values to output to reduce external noise if present. This is wear-free angle measurement made easy.
Learn more.


Radar level sensor monitors liquids and powders

The innovative FR Series non-contact radar level sensor from Keyence has been designed to monitor the level of both liquid and powder in any environment. This sensor features short- and long-range models, as well as chemical and sanitary options to address a wide array of level sensing applications. Works even when obstructions or harsh conditions are present, such as build-up, steam, or turbulence.
Learn more.


Raspberry Pi launches $70 AI Kit

Artificial intelligence (AI) is all the rage, and the makers of Raspberry Pi have created a way for enthusiasts of the single-board computer systems to take part and do a lot of experimenting along the way.
Read the full article.


3D model sharing at Brother Industries cuts rework

When Brother Industries, maker of printers, computers, and computer-related electronics, deployed Lattice Technology's XVL Player as a viewer for sharing 3D models throughout the processes of product design, parts design, mold design, mold production, and QA of molded parts, they reduced rework significantly -- especially from downstream departments. XVL Studio with its Difference Check Option helped address the rework in mold design, for example, by always keeping everyone informed of design changes.
Read this real-world case study.


What is 3D-MID? Molded parts with integrated electronics from HARTING

3D-MID (three-dimensional mechatronic integrated devices) technology combines electronic and mechanical functionalities into a single, 3D component. It replaces the traditional printed circuit board and opens up many new opportunities. It takes injection-molded parts and uses laser-direct structuring to etch areas of conductor structures, which are filled with a copper plating process to create very precise electronic circuits. HARTING, the technology's developer, says it's "Like a PCB, but 3D." Tons of possibilities.
Learn more (video included on page).


New! Thermoelectric dehumidifiers for enclosures

Seifert Systems has just introduced its line of compact Soliflex® Series thermoelectric dehumidifiers, with or without condensate pump. These IP 56-rated units are designed to dehumidify enclosures and small control panels, can be used indoors or outdoors, and are maintenance free. When used with a hygrostat, Soliflex dehumidifiers will keep enclosure humidity below a defined level and only operate when needed.
Learn more.


More Stego enclosure heater options from AutomationDirect

Automation-Direct has added more Stego enclosure heaters to their Enclosure Thermal Management lineup. These new 120 to 240 VAC/VDC units include small, flat versions that distribute heat evenly within compact enclosures and are available with 8- or 10-W heating capacities. Also added are compact loop heaters that feature a patented loop body design for increased natural convection airflow, reduced thermal stress on the heater, and better heat transfer. Loop heaters are available in 10- to 150-W heating capacities.
Learn more.


Great design: Handle with integrated lighting/signaling

Signaling and indicator lights, switches, and buttons -- elements that hardly any machine can do without. The new JW Winco cabinet U-handle EN 6284 integrates all these functions into a single, compact element. The new U-handle is designed to enhance the operation of systems and machines. It features an integrated button and a large, colored, backlit area on the back of the handle. These elements can be used individually or in combination, providing a versatile tool for system control and process monitoring that can be seen from across the room.
Learn more.


Engineer's Toolbox: What is ground loop feedback?

Improper grounding can create problems in data logging, data acquisition, and measurement and control systems. One of the most common problems is known as ground loop feedback. Experts at CAS DataLoggers run through five ways to eliminate this problem.
Read the full article.


AI development kit for multi-camera products

The QCS6490 Vision-AI Development Kit from Avnet enables engineering teams to rapidly prototype hardware, application software, and AI enablement for multi-camera, high-performance, Edge AI-enabled custom embedded products. The kit facilitates design with the new, energy-efficient MSC SM2S-QCS6490 SMARC compute module based on the Qualcomm QCS6490 processor. Provides support for up to four MIPI CSI cameras and concurrent Mini DisplayPort and MIPI DSI displays.
Learn more.


High-temp cabinet cooler keeps incineration process in business

An EXAIR client company handles waste treatment on a large ship by operating an incinerator. The area where the incinerator is located gets very hot (over 120° F). This causes failures in the electronics package used to control the incineration process. Since compressed air is readily available, EXAIR's Model HT4225 Cabinet Cooler System is being used to keep the panel cool. It saved the customer from having to replace their control units due to the hot conditions in the incinerator room. Thermostat control is also available, conserving air and operating only when needed to minimize air consumption.
Learn about EXAIR's huge selection of Cabinet Coolers.


Compact snap-in capacitors for general-purpose applications

TDK's new EPCOS B43659 series of snap-in aluminum electrolytic capacitors is the next generation of ultra-compact, general-purpose components for voltages of 450 V (DC) featuring an extremely high CV product. It provides the same features and serves the same applications as the previous series but is much more compact. These RoHS-compliant capacitors can be used in a wide range of applications, such as switched-mode power supplies, frequency converters, UPS, medical equipment, and solar inverters.
Get all the specs.


Conductive Brush Ring overcomes current leakage in EV powertrains

SKF's new Conductive Brush Ring paves the way to greater reliability and longer life in high-performance electric vehicle powertrain systems. Using pure carbon fiber bristles, it provides a reliable electrical connection between an EV eAxle rotor shaft and its housing. When used in combination with SKF Hybrid ceramic ball bearings, it helps to alleviate parasitic current effects that can lead to premature failure in bearings and other components. Available in different configurations for wet (oil-lubricated) motor designs -- and soon for dry (sealed) applications.
Learn more.


Laser-induced graphene proves to be 'super' for electronics

Rice University researchers test flexible, three-dimensional supercapacitors.

By Mike Williams, Rice Universtiy

Rice University scientists have advanced their recent development of laser-induced graphene (LIG) one big step further by producing and testing stacked, three-dimensional supercapacitors -- energy-storage devices that are important for portable, flexible electronics.

The Rice lab of chemist James Tour discovered last year that firing a laser at an inexpensive polymer burned off other elements and left a film of porous graphene, the much-studied atom-thick lattice of carbon. The researchers viewed the porous, conductive material as a perfect electrode for supercapacitors or electronic circuits.

To prove it, members of the Tour group have since extended their work to make vertically aligned supercapacitors with laser-induced graphene on both sides of a polymer sheet. The sections are then stacked with solid electrolytes in between for a multilayer sandwich with multiple microsupercapacitors.

An electron microscope image shows the cross-section of laser-induced graphene burned into both sides of a polyimide substrate. The flexible material created at Rice University has the potential for use in electronics or for energy storage. [Courtesy of the Tour Group]

 

 

 

 

The flexible stacks show excellent energy-storage capacity and power potential and can be scaled up for commercial applications. LIG can be made in air at ambient temperature, perhaps in industrial quantities through roll-to-roll processes, Tour said.

A schematic shows the process developed by Rice University scientists to make vertical microsupercapacitors with laser-induced graphene. The flexible devices show potential for use in wearable and next-generation electronics. [Courtesy of the Tour Group]

 

 

 

 

The research was reported this month in Applied Materials and Interfaces.

Capacitors use an electrostatic charge to store energy they can release quickly, similar to a camera's flash, for example. Unlike chemical-based rechargeable batteries, capacitors charge fast and release all their energy at once when triggered. But chemical batteries hold far more energy. Supercapacitors combine useful qualities of both -- the fast charge/discharge of capacitors and high-energy capacity of batteries -- into one package.

LIG supercapacitors appear able to do all that with the added benefits of flexibility and scalability. The flexibility ensures they can easily conform to varied packages -- they can be rolled within a cylinder, for instance -- without giving up any of the device's performance.

"What we've made are comparable to microsupercapacitors being commercialized now, but our ability to put devices into a 3D configuration allows us to pack a lot of them into a very small area," Tour said. "We simply stack them up.

"The other key is that we're doing this very simply. Nothing about the process requires a clean room. It's done on a commercial laser system, as found in routine machine shops, in the open air."

Ripples, wrinkles, and sub-10-nanometer pores in the surface and atomic-level imperfections give LIG its ability to store a lot of energy. But the graphene retains its ability to move electrons quickly and gives it the quick charge-and-release characteristics of a supercapacitor. In testing, the researchers charged and discharged the devices for thousands of cycles with almost no loss of capacitance.

To show how well their supercapacitors scale up for applications, the researchers wired pairs of each variety of device in serial and parallel. As expected, they found the serial devices delivered double the working voltage, while the parallels doubled the discharge time at the same current density.

The vertical supercapacitors showed almost no change in electrical performance when flexed, even after 8,000 bending cycles.

Tour said that while thin-film lithium-ion batteries are able to store more energy, LIG supercapacitors of the same size offer three times the performance in power (the speed at which energy flows). And the LIG devices can easily scale up for increased capacity.

"We've demonstrated that these are going to be excellent components of the flexible electronics that will soon be embedded in clothing and consumer goods," he said.

The Air Force Office of Scientific Research and its Multidisciplinary University Research Initiative (MURI) and the Office of Naval Research MURI supported the research.

Published January 2015

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